rigid pcb capability

 

No	Item	Technical data
1	Number of Layers	1-40Layers
2	Max.Board Size	508*610mm
3	Board thickness	0.2-5.0mm
4	Min Line Width/Space	4mil/4mil(0.1/0.1mm)
5	Min.S/M Pitch	0.1mm(4mil)
6	Finish Drill Hole (Mechanical)	0.2mm--6.30mm
7	PTH Wall Thickness	>0.020mm(0.8mil)
8	Hole Dia.Tolerance(PTH)	±0.075mm(3mil)
9	Hole Dia.Tolerance(NPTH)	±0.05mm (2mil)
10	Hole Position Deviation	±0.05mm (2mil)
11	Outline Tolerance	±0.10mm (4mil)
12	Twist&Bow	≤0.7%
13	Insulation Resistance	>1012Ω Normal
14	Through hole resistance	<300Ω Normal
15	Electric strength	>1.3 kv/mm
16	Current breakdown	10A
17	Peel strength	1.4N/mm
18	S/M abrasion	>6H
19	Thermal stress	288℃ 20 Sec
20	Test Voltage	50-300V
21	Min. blind/buried via	0.2mm/0.2mm(Mechanical) 0.1mm/0.2mm(Laser)
22	Available Laminates Material	CEM1, CEM3, FR-4, High-Tg FR4, Aluminum Base, Rogers, Taconic, Arlon etc.
23	Finished board thickness tolerance	T>=0.8mm, Tolerance: +/-8%, T<0.8mm : +/-10%
24	Out Layer Copper Thickness	1oz--6oz
25	Inner Layer Copper Thickness	1/2oz--4oz
26	Aspect Ratio	15:1
27	SMT Mini. Solder Mask Width	0.08mm
28	Mini. Solder Mask Clearance	0.05mm
29	Plug Hole Diameter	0.2mm--0.60mm
30	Impedance Control Tolerance	+/-10%
31	Surface Finish	HASL,HAL（Lead free）,Immersion Gold/Tin/Silver，Gold Plated, OSP, Gold Finger, Peelable mask
32	Insulation Layer Thickness	0.075mm--5.00mm
33	Special technology	Thick hard gold plating, Via in Pad, Counterbore&Countersunk etc.

flexible pcb capability

 

NO	ITEM	TECHNICAL DATA
1	Number of layers	Flex: 1~6layer Rigid/flex: 2-10layer
2	Min trace Width/Spacing	12 & 18um (base Cu): 0.075/0.075mm 35um (base Cu): 0.1/0.1mm
3	Min Space Between Coverlay Openings	0.2mm
4	Edge of Coverlay Opening to Trace	0.20mm(preferred)
5	Min Space between coverlay & solder pad	0.15mm
6	Polyimide Films	0.5 mil (12.5µ), 1 mil (25µ), 2 mils (50µ), 3 mils (75µ), 4mils (100µ) as custmer requested.
7	Thermobond Adhesives	Acrylic/Modified Acrylic, Modified Epoxy, Polyimide
8	Copper Foils (RA or ED)	1/3oz (12µ), 1/2oz (18µ), 1oz (35µ), 2oz (70µ)
9	Stiffeners	Polyimide, rigid FR4, PSA, metal, etc.
10	FR-4 in Multi-layer Flex Circuits	Laminated to flex circuit to create rigid flex boards, typically with vias.
11	Surface Finish	Electroless Ni/Au, Electrolytic soft/hard gold, Tin plating, Imm.Tin, Entek/OSP
12	Solder Resists	Coverlay, Photo-Imagable Resist
13	Hole tolerance	±0.05mm
14	Smallest Drill Size	0.2mm
15	Largest Drill Size	6.35mm
16	Smallest Slot Width	0.35mm
17	Min.spacing between holes	0.15mm
18	Minimum conductor edge to outline edge	≥0.1mm
19	Min Spacing between coverlay & conductor	± 0.15mm
20	Hole to outline edge	≥ 0.10mm
21	Max Layer to Layer Mis-registration	± 0.10mm
22	Tooling tolerances	Steel(Hard) tooling : ± 0.05mm CNC drill/rout : ± 0.10mm Knife(Soft) tooling : ± 0.25mm
23	Copper Plated Thickness (PTH only)	8~15um; 20~30um; 30~70um(special)
24	Au thickness	Electroless: Ni/Au Ni: 2~6um;Au:0.035~0.075um Electrolytic soft/hard gold Ni: 2~9um;Au: 0.035~0.1um

metal core pcb capability

 

NO	ITEM	TECHNICAL DATA
1	Number of Layers	1-2Layers
2	Material	Aluminum / Copper base
3	Final Thickness	0.5-3.0mm
4	Max Size	1200mm x 600mm
5	Insulating Layer Thickness	50, 75, 100, 125, 150micron
6	Min trace Width/Spacing	6mil/6mil(0.15/0.15mm)
7	Copper Thickness	0.5oz-3oz
8	Min hole size	0.6mm
9	Thermal Conductivity	1.0-4.0W/m.K
10	Aluminum Type	3003, 5052, 6061 etc.
11	Breakdown voltage	2-8KV
12	Min Solder Dam	4mil
13	Min Hole Ring	4mil
14	Twist&Bow	≤0.7%
15	Test Voltage	50-300V
16	Solder Mask Colour	White, Black, Red, Green, Blue, Yellow
17	Silkscreen colour	White, Black
18	Tolerance of Profile	+/-5mil
19	Peel Strength	≥ 1.8 N/MM
20	Surface Resistance	≥ 1*105 M
21	Permittivity	≤ 4.4
22	Disspation Factor	≤ 0.03
23	Surface Treatment	HAL(Lead.free), Immersion gold/Tin, OSP, Gold plating